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.High level power integration
.Two screws mountiong to the customer heatsink ,compactdesign
.Low thermal impedance due to durable ceramic insulation
.Pressure contact technology with simple connection to DCB through pressure contact (no soldering)and with increased power cycling capability
.High power density.Low losses
.Integrated temperature sensor
Diode IGBT; 3-Phase Bridge/Braking Chopper; M8a.